EFD Solder Paste Group continuously strives to exceed workmanship standards of IPC (The Institute for Interconnecting and Packaging Electronic Circuits) Guidelines for the following J-Standards to guarantee customer satisfaction.
- J-STD-003 – Solderability Test for Printed Boards
- J-STD-004 – General Requirements and Test Methods for Soldering Fluxes
- J-STD-005 – General Requirements and Test Methods for Soldering Paste
- J-STD-006 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
For more information on IPC, please visit www.ipc.org. |