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PrintPlus® Printing Paste
EFD’s print paste is the principal choice for Surface Mount Technology (SMT) applications. PrintPlus printing paste glides smoothly over stencils filling the apertures without voids and leaves little to no slump. Available in different alloys, alloy particle sizes, and flux types — including lead-free formulations.
Whether you are soldering to stainless steel, assembling a flex circuit or anything in between, EFD makes a solder paste to meet your soldering needs. Find your formulation.
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To better assist our customers in finding the right solder pastes for their applications, our solder paste formulations have been broken down into different categories called Families. Each family contains solder paste formulations with the characteristics needed to produce optimal results in specific applications. |
General Purpose
Clear Residue
Enhanced Wetting
Fine Pitch
Reduced Slump
Restricted Residue |
Lead-free Shiny Fillet
Halide-free
Difficult-to-Solder Surfaces
24-hour Print Life
Extended Reflow Cycle Times (> 6 minutes)
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