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Enhanced Wetting

Suitable for applications needing good spread across an area larger than the solder paste deposit and/or wetting to moderately oxidized surfaces and moderately difficult-to-solder metals.

Typical Applications include older, oxidized SMT and through-hole components, and Alloy42 leaded devices.

Available in NC, WS, RMA, and RA.

Flux Type	SolderPlus® Dispense Formulation	Additional Features	FluxPlus™ Flux Formulation	Flux Class
NC	NCLR or D501	Low Residue	6-412	ROL1
NC	D502	Extended Reflow	6-412	ROL1
RMA	RMA21	Increased Activity	-	ROL0
RA	RA31 or D310	Increased Activity	6-410	ROM1
WS	WS44 or D440	High Temperature	6-416	ORM1

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