Languages Languages
CompanyDispensersDispense ValvesTipsSyringe BarrelsSolder PasteSpecialty ProductsMicroCoatIndustries
Home  >  Solder Paste  >  Solder Dictionary  
 

Solder Dictionary

 
Activator
Alloy
Ball Grid Array (BGA)
Brazing
Brazing Alloys
Bridging
Bumped Circuit Boards
Burn In
Capillary Action
Cold Solder Joint
Compacting
Copper Mirror Test
Dendrites
De-soldering
De-wetting
Dissolution
Disturbed Solder Joint
Drawbridging
Eutectic
Fillet
Fine Pitch
Flux
Halides
High Temp Alloy
Hygroscopic
Icicle
Intermetallic Layer
J-Standard
Leaching
Liquidus
Low Temp Alloy
Manhattan Effect
Masking
Melting Point
Molten
No Clean (NC)		 Non-Wetting
Outgassing
Oxidation
Particle Size
Pitch
Plating
Popcorning
Preheat
Printing
Profile
Rosin Activated (RA)
Reflow
Residue
Rosin Mildly Activated (RMA)
Rosin/Resin (RA)
Surface Insulation Resistance (SIR)
Slump
Solder Balls
Solderability
Solder Paste
Solidus
Solvent
Spatter
Step Soldering
Tackiness
Tensile Strength
Through Hole
Tin Whiskers
Tinning
Tombstoning
Viscosity
Voids
Water Soluble Paste (WS)
Wave Soldering
Webbing
Wetting
   
© 2008  Nordson Corporation About EFD   Careers   Contact us   WEEE   Privacy Statement   Site map