Solder Reflow System

 
The EFD® ProcessMate™ 6100 Hot Air Reflow System accurately controls air temperature to ± 5ºC.
ProcessMate™ 6100 Hot Air Reflow System
This system uses an active feedback loop to accurately control air temperature to ± 5ºC. Temperature settings range from 100ºC to 480ºC adjustable in 1ºC increments. Precise temperature and air flow control permit a larger reflow process window without the risk of overheating components.

When used with EFD SolderPlus® dispensing solder paste, the ProcessMate 6100 reduces operator variability, rework and scrap while increasing productivity and production yields, without the special training requirements typical with wire-and-iron soldering.
More information
Data Sheet
PDF - 109 kb






   
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